Smart Surfaces, Strategic Stakes: IP Battle for RIS in RF

SOPHIA ANTIPOLIS, France – April 14, 2025 │ Subtle yet transformative, reconfigurable intelligent surfaces (RIS) are quietly rewriting the rules of radio frequency (RF) communication. As we stand at the threshold of the 6G era, RIS is no longer just a promising concept in academic papers, it has become an intellectual property (IP) battleground where[…]

Featured image of the article Pure Player Lightmatter is Securing Optical Interposer Intellectual Property Shares.

Pure Player Lightmatter is Securing Optical Interposer Intellectual Property Shares

SOPHIA ANTIPOLIS, France – April 07, 2025 │ Optical interposers are a crucial technology for advanced semiconductor packaging and co-packaged optics, driving the rapid growth of artificial intelligence (AI) and high-performance computing (HPC) applications by enabling data transmission through light rather than traditional electrical signaling. Several companies are actively developing optical interposers and related photonics.[…]

Featured image of the article Sensing Meets Signal: ISAC Defines the New Patent Warzone in Wireless Communications.

Sensing Meets Signal: ISAC Defines the New Patent Warzone in Wireless Communications

SOPHIA ANTIPOLIS, France – April 1, 2025 │ Integrated Sensing and Communication (ISAC) is rapidly emerging as a pivotal innovation within the wireless communication industry, shaping the evolution of 5G-Advanced and 6G technologies. Since 2020, around 2,000 related patent families have been filed globally, underscoring significant strategic investments by major telecom companies. By integrating radar-like[…]

Featured image of the article Glass Core Substrates and Interposers for Advanced Packaging: Insights from the Intellectual Property Landscape.

Glass Core Substrates and Interposers for Advanced Packaging: Insights from the Intellectual Property Landscape

SOPHIA ANTIPOLIS, France – January 9, 2025 │ Advanced semiconductor packaging is a rapidly evolving field where multiple technologies are being developed simultaneously. The integration of glass into substrates and interposers within semiconductor packages has the potential to accelerate the development of emerging technologies targeting applications such as artificial intelligence (AI), high-performance computing (HPC) and[…]