TongFu Microelectronics is investing in hybrid bonding intellectual property to bolster its advanced packaging activities
SOPHIA ANTIPOLIS, France – September 12, 2024 │ Artificial intelligence (AI) and high-performance computing (HPC) are considered crucial for both economic and military strength. In this context, the U.S. has implemented various restrictions on China, particularly aimed at the semiconductor industry, including limiting the sale of advanced chips and related manufacturing equipment to Chinese companies.[…]