Packaging news

Featured image of the article Glass Core Substrates and Interposers for Advanced Packaging: Insights from the Intellectual Property Landscape.

Glass Core Substrates and Interposers for Advanced Packaging: Insights from the Intellectual Property Landscape

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SOPHIA ANTIPOLIS, France – January 9, 2025 │ Advanced semiconductor packaging is a rapidly evolving field where multiple technologies are being developed simultaneously. The integration of glass into substrates and interposers within semiconductor packages has the potential to accelerate the development of emerging technologies targeting applications such as artificial intelligence (AI), high-performance computing (HPC) and[…]

Featured image of the article TongFu Microelectronics is investing in hybrid bonding intellectual property to bolster its advanced packaging activities.

TongFu Microelectronics is investing in hybrid bonding intellectual property to bolster its advanced packaging activities

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SOPHIA ANTIPOLIS, France – September 12, 2024 │ Artificial intelligence (AI) and high-performance computing (HPC) are considered crucial for both economic and military strength. In this context, the U.S. has implemented various restrictions on China, particularly aimed at the semiconductor industry, including limiting the sale of advanced chips and related manufacturing equipment to Chinese companies.[…]

Advanced semiconductor packaging: leading patent owners and new entrants

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SOPHIA ANTIPOLIS, France – September 06, 2024 │Propelled by the increasing demand for data processing in high-performance computing (HPC) applications, 5G and beyond communication networks, and autonomous vehicles, a tremendous number of new inventions related to advanced semiconductor packaging have been published in recent years. By analyzing patents, the technological evolutions and the competitive landscape[…]