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Featured image of the article TongFu Microelectronics is investing in hybrid bonding intellectual property to bolster its advanced packaging activities.

TongFu Microelectronics is investing in hybrid bonding intellectual property to bolster its advanced packaging activities

Posted on September 12, 2024September 13, 2024 by knowmade

SOPHIA ANTIPOLIS, France – September 12, 2024 │ Artificial intelligence (AI) and high-performance computing (HPC) are considered crucial for both economic and military strength. In this context, the U.S. has implemented various restrictions on China, particularly aimed at the semiconductor industry, including limiting the sale of advanced chips and related manufacturing equipment to Chinese companies.[…]

Advanced semiconductor packaging: leading patent owners and new entrants

Posted on September 6, 2024 by knowmade

SOPHIA ANTIPOLIS, France – September 06, 2024 │Propelled by the increasing demand for data processing in high-performance computing (HPC) applications, 5G and beyond communication networks, and autonomous vehicles, a tremendous number of new inventions related to advanced semiconductor packaging have been published in recent years. By analyzing patents, the technological evolutions and the competitive landscape[…]

How is 3D TSV a reality?

Posted on January 12, 2017March 2, 2023 by knowmade

SOPHIA ANTIPOLIS, France – January 12, 2017| 3D is becoming a key technology platform for increase integration, either for heterogeneous integration (like for MEMS and CMOS image sensor) or for increasing the performances (like for DRAM and IC partitioning). When a company has started to adopt TSV, there is no turning back. In 2016 again,[…]