Who are the key players and newcomers in the global IP race for the most advanced bonding technology shaping the future of semiconductor packaging? Publication August 2024 Download Flyer Download Sample KEY FEATURES PDF>70 slides Excel file>1,600 patent families Global patenting trends, including time evolution of patent publications, countries of patent filings, etc. Main patent[…]
Major companies have patented variety of solutions to protect their own AiP structures and manufacturing processes. What are the white spaces left? Is the freedom to operate hampered ? Publication June 2021 Download Flyer Download Sample Report’s Key Features PDF with > 80 slides Excel file > 660 patent families + hyperlink to updated online[…]
KnowMade has just published a new report, updating this analysis in 2024. Follow this link to discover it: Hybrid Bonding Patent Landscape 2024. Who has the ability to hamper the development of products using hybrid bonding processes? Publication November 2019 Download Flyer Download Sample Report’s Key Features PDF with > 80[…]
The semiconductor industry has all the attributes that appeal to patent licensing companies (PLCs): Are you in their sights? Publication February 2017 Download Flyer Download Sample Report’s Key Features PDF > 100 slides Ranking of PLCs according to their recent patent acquisitions in the semiconductor field Dynamics of patent acquisitions and patented technology including memory,[…]