…multiple dies into a single package, with the possibility of combining mature and advanced nodes, and they have supplemented the dominant flip-chip (FC) and wire-bond (WB) technologies. The roadmap for these advanced packaging technologies is challenging and the supply chain is becoming increasingly competitive, with the demand for high-density fan-out…
…mid-1990s by silicon power companies (Furukawa Electric, International Rectifier, Infineon …). But the take-off of patenting activity was really observed ten years later with a first wave of patent publications over the 2005-2009 period, mainly due to American companies (International Rectifier, Power Integrations) and Japanese companies (Panasonic, Rohm, Furukawa Electric,…
SOPHIA ANTIPOLIS, France – September 06, 2024 │Propelled by the increasing demand for data processing in high-performance computing (HPC) applications, 5G and beyond communication networks, and autonomous vehicles, a tremendous number of new inventions related to advanced semiconductor packaging have been published in recent years. By analyzing patents, the technological…
…future paths: HBM3 with higher capacity and higher bandwidth and low cost HBM (with significant cost savings arrive from the narrower width allowing for simpler memory stacks with less TSVs). SK Hynix entered in production of HBM1 2Gb in 2014 for graphic and cache applications and will commence mass production…