Webinar – Advanced Semiconductor Packaging: leading patent owners and new entrants
SOPHIA ANTIPOLIS, France – May 30, 2024 │Dr. Pauline Calka shared her expertise on Advanced Semiconductor Packaging, focusing on leading patent owners and new entrants in fan-out WLP, interposer, bridge, and hybrid bonding technologies. All the materials are gathered below. Webinar video recording https://www.knowmade.com/wp-content/uploads/2024/05/Webinar_Advanced-Semiconductor-Packaging_2024-05-30.mp4 About the subject Since 2016, KnowMade…