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Webinar – Advanced Semiconductor Packaging: leading patent owners and new entrants

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SOPHIA ANTIPOLIS, France – May 30, 2024 │Dr. Pauline Calka shared her expertise on Advanced Semiconductor Packaging, focusing on leading patent owners and new entrants in fan-out WLP, interposer, bridge, and hybrid bonding technologies. All the materials are gathered below. Webinar video recording https://www.knowmade.com/wp-content/uploads/2024/05/Webinar_Advanced-Semiconductor-Packaging_2024-05-30.mp4 About the subject Since 2016, KnowMade…

Webinar – Acoustic Wave Filters in China

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…video recording https://www.knowmade.com/wp-content/uploads/2024/03/Knowmade-Webinar-_-Acoustic-Wave-Filters-in-China-_-2024-03-19.mp4 About the subject Since 2017, KnowMade has closely observed and dissected the ever-changing landscape of intellectual property (IP) related to acoustic wave filters. The advent of 5G has wielded a profound impact on this ecosystem, ushering in new technologies like composite substrates and AlScN, attracting a wave…

Advanced Packaging Patent Monitor

…the integration of multiple dies into a single package, with the possibility of combining mature and advanced nodes, and they have supplemented the dominant flip-chip (FC) and wire-bond (WB) technologies. The roadmap for these advanced packaging technologies is challenging and the supply chain is becoming increasingly competitive, with the demand…

Nanopore Sequencing Patent Landscape 2019

…$US 4.83B in 2017 to $US 16.35B in 2024, at an estimated compound annual growth rate (CAGR) of 19.2% (from 2018 – 2024). Today, Oxford Nanopore Technologies is the only company to have brought nanopore-based sequencers to market. However, several other companies are developing their own technology, and Oxford Nanopore…