Hybrid Bonding Patent Landscape 2019

    KnowMade has just published a new report, updating this analysis in 2024. Follow this link to discover it: Hybrid Bonding Patent Landscape 2024.   Who has the ability to hamper the development of products using hybrid bonding processes? Publication November 2019  Single user license – €5,990.00  Multi user license – €6,490.00 Add…

GaN Electronics Patent Monitor

…with our IP analysts regarding trends, analyses, specific patented technologies or company’s IP portfolio. Access all KnowMade patent landscapes about semiconductors. Specialized patent landscape and customized study services available. RF GaN The RF GaN market is growing fast – driven by military and telecom applications – and there is still…

Patent Activity Surrounding GaN and Diamond Integration

…in terms of IP. References [1] en.wikipedia.org/wiki/Material_properties_of_diamond#Thermal_conductivity [2] onlinelibrary.wiley.com/doi/10.1002/smll.202305574 Press contact contact@knowmade.fr Le Drakkar, 2405 route des Dolines, 06560 Valbonne Sophia Antipolis, France www.knowmade.com About the author Rémi Comyn works for KnowMade as a Patent Analyst in the field of Compound Semiconductors and Electronics. He holds a PhD in Physics…

Advanced semiconductor packaging: leading patent owners and new entrants

SOPHIA ANTIPOLIS, France – September 06, 2024 │Propelled by the increasing demand for data processing in high-performance computing (HPC) applications, 5G and beyond communication networks, and autonomous vehicles, a tremendous number of new inventions related to advanced semiconductor packaging have been published in recent years. By analyzing patents, the technological…