Get up-to-date data on Advanced Semiconductor Packaging patent activity: New patent applications, patents newly granted, expired or abandoned patents, latest patent transfers, patent litigations and oppositions.
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Key Features of the service
Every quarter:
- One-hour presentation of results, Q&A, and discussions.
- PDF report highlighting the key trends and significant information, with a close look at the key IP players and patented technologies.
- Updated Excel database to access all patents and relevant information (new patents applications, granted patents, expired or abandoned patents, patent transactions, IP collaborations, patent litigations and oppositions).
Throughout the year:
- Direct access to the IP analyst
- to address any inquiries you may have regarding reports’ results.
- to conduct additional research on specific technologies or companies’ patent portfolios.
- to customize the monitoring service by adding specific players and/or specific segments.
Objectives of the service:
- Get a clearer view of the technology evolution
- Track your competitors and identify the newcomers
- Early detect opportunities and risks
- Take advantage of free technologies
KnowMade also offers patent landscapes on semiconductors and related technologies.
Since advanced semiconductor packaging is experiencing significant growth, it is crucial to monitor the patent activity and IP strategies of key players
In the semiconductor industry, there is a growing demand for integrating more compute and memory within a single package in order to achieve smaller form factors and improve product performance. However, Moore’s Law becomes increasingly difficult to achieve as node advancement reaches its limits. As a result, the process of chip miniaturization has been slowing down. Advanced packaging techniques, such as 2.5D & 3D stacking, and fan-out wafer level packaging, have emerged as crucial solutions to meet the needs of the semiconductor industry. These new approaches allow for the integration of multiple dies into a single package, with the possibility of combining mature and advanced nodes, and they have supplemented the dominant flip-chip (FC) and wire-bond (WB) technologies. The roadmap for these advanced packaging technologies is challenging and the supply chain is becoming increasingly competitive, with the demand for high-density fan-out (HD FO) redistribution layers (RDLs), high-density input/output interconnections (I/O), and advanced interconnect technologies such as silicon or glass interposers, embedded bridges, hybrid bonding, and optical interconnects. The market for 2.5D/3D packaging shows the most potential for growth, with 3D SoC technology growing the most driven by the increasing popularity of hybrid bonding for chiplets 3D integration. In the fan-out WLP industry, the segment experiencing the highest growth is the ultra-high density fan-out (UHD FO), which has emerged as a more cost-effective solution compared to silicon interposers. Semiconductor packaging was primarily performed by OSATs such as ASE/SPIL, Amkor, JCET, etc. and they continue to play an important role in this field. However, it is TSMC, Samsung and Intel that have been developing innovative 2.5D/3D packaging solutions. By offering advanced back-end solutions and using their front-end capabilities, these companies poised to influence future technology and intellectual property (IP) developments in this area.
In this context, it is crucial to monitor patent activity and intellectual property (IP) strategies of key players. Such knowledge can assist in understanding your competitors’ R&D roadmap and strategies, evaluate the risks, and detect business opportunities. The Advanced Semiconductor Packaging Patent Monitor gives periodic insights on the IP activity of a selection of key companies: TSMC, Intel, Samsung, Amkor, ASE, SPIL, JCET, Deca, Nepes, Powertech (PTI), SJSemi, Tongfu (TFME), Huatian, Infineon, Micron, SK Hynix, YMTC, GlobalFoundries, and Xperi/Adeia.
The added value of this monitoring service lies in year-round access to the analyst, offering opportunities to request additional research on specific technologies or companies’ patent portfolios and to adapt the monitoring service to your needs by adding specific players and/or specific segments.
Benefits of the patent monitoring service
Keep a watch on your competitors’ IP activities and their future intentions.
With the help of the patent monitoring service, you will be aware of your competitors’ current patenting activities, their IP dynamics, patent transfers including acquisitions and licenses, patent litigation, technology development and R&D strategies. You will also be able to early detect new entrants in your business area.
Keep track of the latest technology developments and be ahead of technology trends.
By keeping note of any recent patent filings, you can track the newest innovations in the field. You will get details on claimed inventions and you can follow technology developments. New technical solutions could inspire and improve your R&D activity.
Prevent registration of IP rights that may be harmful to your business.
You will obtain information on patent applications filed even before exclusive rights have been granted and you can react in time to prevent registration of IP rights that may be harmful to your business.
React in time to infringements and mitigate legal risks.
Monitoring newly-issued patents allows you to regularly assess your freedom-to-operate, ensuring your products or processes are not covered by patents, and thus that they can be manufactured, sold or used safely without infringing valid IP rights owned by others.
Take advantage of free technologies and decrease R&D project risks.
By tracking both expired patents and abandoned patents, you will be able to identify inventions entering the public domain that you can use safely for your development.
Understand the current IP trends and IP strategy of competitors.
On a quarterly basis, the report will provide the IP trends over the three last months, with a close look to key IP players and key patented technologies. Main patent applicants and their inventions, blocking patents, promising patents and key patents newly expired or abandoned will be highlighted.
Access to the IP analyst.
Take advantage of direct interaction with our analysts by phone and/or email for result presentations, Q&A sessions, additional research on specific technologies or companies’ patent portfolios, and customization of the monitoring service by adding specific players and/or specific segments.
If you need a quote to issue a purchase order, please use our contact page or email address contact@knowmade.fr.